Semiconductor Testing & Prober Technology Insights

Success Story – High Frequency Wafer Prober System - Denmark

Written by Denis Place | May 15, 2026

Customer Requirements:

Multi-Purpose manual probing solution for die, partial wafers, wafers up to 200 mm and wafers mounted on frames.

Vibration Isolation Table and Dark Box

Combination of DC and HF manipulators and probe arms

SemiProbe Solution:

 

Key System Components:

Lab Assistant – Model LA-200 – is a small footprint manual probing system with a wafer stage that provides 205 mm x 205 mm of X & Y travel, a 20 mm Z movement and coarse and fine theta.

High Frequency Chuck – ambient, 200 mm vacuum holes with two (2) calibration substrate holders and selectable zones

Large Platen – aluminum with a steel skin and a removable front wedge. Platen allows manipulators and probe cards to be used. Platen has a 15 mm manual lift.

Microscope Post with a 100 mm x 100 mm low-profile X & Y coaxial microscope movement with locking knobs and microscope adapter.

Stereo zoom Optics – with eyepieces and a c-mount camera port, magnification of 100x and a working distance of 100 mm with a large field of view

CCTV System – camera adapter, color camera, 24” color monitor, power supply, and cords

Vibration Isolation Table – table frame with casters and leveling feet, metric optical breadboard and monitor post.

Dark Box – front opening door that raises upwards, chuck switch panel, light, interconnect panel with coaxial feedthrough connectors and a rubberized boot for direct cable feedthrough into the dark box.

Manipulators – six (6) manual MA-9000 body with magnetic base, four (4) adjustable probe arm faceplates, four (4) coaxial probe arms, and two (2) high frequency probe arms – West/East

Probes – DC, 12.5 um radius tungsten; High Frequency, GSG, 150 um, 40 GHz

Calibration substrate

Junkosha 40 GHz HF cables, 48” long

 

MA-9000 Manual Manipulator with magnetic base and West/East High Frequency probe arm

GGB Model 40A GSG-150 um pitch high frequency probe

200 mm High Frequency chuck with vacuum holes, selectable zones and two (2) auxiliary chucks for calibration substrates and or probe tip cleaning pad.