Customer Requirements:
- Semiautomatic 300 mm Double Sided Probing (DSP) System to characterize several different types and sizes of silicon photonic devices in a shielded environment. The system had to test 150 mm, 200 mm and 300 mm wafers and individual die.
SemiProbe Solution:
- 300 mm Semiautomatic DSP Optoelectronic Device Characterization System with programmable X, Y, Z and theta movement and control electronics
- Localized Environmental Chamber (LEC) with Top Hat to provide dark and EMI shielded environment
- Customized vibration isolation table (VIT)
- Large travel gantry to accommodate a few different types of optics and instruments. Independently controlled X, Y, and Z movements – manual and programmable
- Manual manipulators for topside and bottom side probing and a probe card holder
- Non-Contact Height Measurement Sensor
- Topside and bottom-side optics and cameras
- Universal carrier plate to hold different sized die, partial wafers and whole wafers up to 300 mm
- Detector mounted on a small travel programmable stage for optimization of output light collection
SemiProbe PS4L SA-12 Semiautomatic Double-Sided Probing Optoelectronic Device Characterization System - configured to test silicon photonic wafers and die
PS4L SA-12 Semiautomatic DSP Optoelectronic Device Characterization System with a localized environmental chamber (LEC) to provide EMI and Light shielding. A large optics gantry to hold multiple optical devices
PS4L SA-12 Semiautomatic Double-Sided Probing (DSP) Optoelectronic Device Characterization System for testing 200 mm and 300 mm silicon photonic wafer
PS4L SA-12 Semiautomatic Double-Sided Probing (DSP) Optoelectronic Device Characterization System with top and bottom platens and manipulators