---
title: Success Story – Optoelectronics Device Characterization - Germany
description: Learn about an advanced Optoelectronics Device Characterization wafer probing system
---

[Semiconductor Testing & Prober Technology Insights ](https://blog.semiprobe.com)

# [Success Story – Optoelectronics Device Characterization - Germany](https://blog.semiprobe.com/optoelectronics-device-characterization)

 Written by [Denis Place](https://blog.semiprobe.com/author/denis-place) | October 17, 2023

Customer Requirements: 

- Semiautomatic 300 mm Double Sided Probing (DSP) System to characterize several different types and sizes of silicon photonic devices in a shielded environment.  The system had to test 150 mm, 200 mm and 300 mm wafers and individual die.

SemiProbe Solution: 

- 300 mm Semiautomatic DSP Optoelectronic Device Characterization System with programmable X, Y, Z and theta movement and control electronics
- Localized Environmental Chamber (LEC) with Top Hat to provide dark and EMI shielded environment
- Customized vibration isolation table (VIT)
- Large travel gantry to accommodate a few different types of optics and instruments. Independently controlled X, Y, and Z movements – manual and programmable
- Manual manipulators for topside and bottom side probing and a probe card holder

- Non-Contact Height Measurement Sensor
- Topside and bottom-side optics and cameras
- Universal carrier plate to hold different sized die, partial wafers and whole wafers up to 300 mm

- Detector mounted on a small travel programmable stage for optimization of output light collection 

SemiProbe PS4L SA-12 Semiautomatic Double-Sided Probing  Optoelectronic Device Characterization System - configured to test silicon photonic wafers and die

 

 

 

PS4L SA-12 Semiautomatic DSP Optoelectronic Device Characterization System with a localized environmental chamber (LEC) to provide EMI and Light shielding.  A large optics gantry to hold multiple optical devices

 

 

PS4L SA-12 Semiautomatic Double-Sided Probing (DSP) Optoelectronic Device Characterization System for testing 200 mm and 300 mm silicon photonic wafer

 

 

PS4L SA-12 Semiautomatic Double-Sided Probing (DSP) Optoelectronic Device Characterization System with top and bottom platens and manipulators

 

[View full post](https://blog.semiprobe.com/optoelectronics-device-characterization)

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