Success Story – Optoelectronics Device Characterization - Germany

Customer Requirements: 

• Semiautomatic 300 mm Double Sided Probing (DSP) System to characterize several different types and sizes of silicon photonic devices in a shielded environment.  The system had to test 150 mm, 200 mm and 300 mm wafers and individual die.

SemiProbe Solution: 

• 300 mm Semiautomatic DSP Optoelectronic Device Characterization System with programmable X, Y, Z and theta movement and control electronics
• Localized Environmental Chamber (LEC) with Top Hat to provide dark and EMI shielded environment
• Customized vibration isolation table (VIT)
• Large travel gantry to accommodate a few different types of optics and instruments. Independently controlled X, Y, and Z movements – manual and programmable
• Manual manipulators for topside and bottom side probing and a probe card holder

• Non-Contact Height Measurement Sensor
• Topside and bottom-side optics and cameras
• Universal carrier plate to hold different sized die, partial wafers and whole wafers up to 300 mm

• Detector mounted on a small travel programmable stage for optimization of output light collection 
  
  

SemiProbe PS4L SA-12 Semiautomatic Double-Sided Probing  Optoelectronic Device Characterization System - configured to test silicon photonic wafers and die

PS4L SA-12 Semiautomatic DSP Optoelectronic Device Characterization System with a localized environmental chamber (LEC) to provide EMI and Light shielding.  A large optics gantry to hold multiple optical devices

PS4L SA-12 Semiautomatic Double-Sided Probing (DSP) Optoelectronic Device Characterization System for testing 200 mm and 300 mm silicon photonic wafer

PS4L SA-12 Semiautomatic Double-Sided Probing (DSP) Optoelectronic Device Characterization System with top and bottom platens and manipulators