Semiconductor Testing & Prober Technology Insights

Success Story - Fully Automated Vacuum Probing System for Testing MEMS wafers up to 150 mm

Written by Denis Place | July 23, 2019

Success Story – MEMS – United States

Customer Requirements:

  • Fully Automatic vacuum probing system for high volume testing of MEMS wafers
  • The system had to handle 100 mm and 150 mm wafers automatically and operate in a vacuum environment to 15x10-3 Torr
  • DC and High Frequency probe tips and a vacuum compatible high pin probe card with up to 100 SMA connections
  • Wafers are standard silicon and or silicon with EPI layers
  • Die size ranged from 3 mm to 9 mm in size and Bond Pads ranged from 2 mil to 4 mil

 

SemiProbe Solution:


Fully Automated Vacuum Prober for MEMS Testing

Key System Components:

  • Vibration Isolation Table (VIT)
  • Vacuum Chamber with side and front-loading wafer capabilities and removable top
  •  
  • 150 mm wafer stage with programmable X, Y, Z and theta stage
  • Ambient chuck with mechanical wafer clamping
  • Material Handling Unit (MHU) – single cassette (100 mm & 150 mm) with end effector, pre-aligner and load lock
  • Large travel microscope movement with Zoom Tube optics and CCTV System
  • Three (3) programmable three (3) axis manipulators with customized probe arms – DC & HF
  • Probe Card Holder (PCH)
  • Software – PILOT Suite (Pilot, Wafer Map, Auto-Align and MHU)
  • Turbo Molecular Vacuum Pump with Dual Channel Throttle Valve Controller

 

  Material Handling Unit (MHU) with Cassette and Load Lock

System Summary:

The probe system can be operated in semiautomatic and fully automatic modes. It can be controlled locally or remotely.

To learn about more advanced MEMS Wafer Probers Click Here