Customer Requirements:
The customer wanted to test 150 mm silicon MEMS wafers in a fully automatic mode under vacuum. The wafers would be mounted in a single cassette into a material handling chamber with a load lock. The material handling unit (MHU) would remove a wafer from the cassette and place it on a mechanically clamping chuck mounted on the probe system vacuum stage in the After alignment the device testing would be performed using a probe card or individual programmable manipulators with DC and High Frequency (HF) probe arms and probes. Everything within the chamber would need to be vacuum compatible.
Fully Automatic Vacuum Probing System
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