Semiconductor Wafer Prober Testing & Prober Technology Insights

Success Story – Wafer Device Characterization - Singapore

December 03, 2021

Customer Device Characterization Requirements:

A highly configurable 200 mm semiautomatic device characterization probe system that would interface to a Keysight B1500 and controlled via their EasyExpert software. The probe system had to operate from -60 to 200 C, providing the ability to make multiple types of measurements – low leakage, low capacitance, low voltage, and low resistance as well as high frequency.

High magnification optics to see features in the micron range were required as well as a family of manual and programmable manipulators manufactured by SemiProbe and Imina Technologies to contact pads and sub-micron features.  

SemiProbe Device Characterization Solution:

Key Device Characterization System Components:

Built using SemiProbe’ s patented Probe System for Life (PS4L) Adaptive Architecture consisting of:

  •   A TMC vibration isolation table (VIT) with casters,  leveling feet and adjustable keyboard/monitor rack
  •   A 200 mm programmable X, Y,Z, and Theta stage with control electronics
  •   A 200 mm, gold plated triaxial thermal chuck with vacuum holes that operates from -60 C to 200 C that is mounted to a large travel load-stroke for easy device loading and unloading
  •   A localized environmental chamber (LEC) with top hat to provide frost-free, dark and EMI shielding
  •   A linear platen lift that provides course and fine platen movement in Z
  •   A large aluminum platen with stainless steel skin that has a removable front wedge. Platen allows manipulators to be placed anywhere around the platen opening.
  •   A second and recessed platen for the addition of multiple Imina Technologies miBot nanopositioners
  •   A compound microscope bridge with a 50 mm x 50 mm x 80 mm X, Y and Z travel
  •   Compound Microscope with 2x, 10x, 20x, 50x and 100x objectives
  •   A CCTV System consisting of a color camera, color monitor, c-mount camera adapter, and cables
  •   PC/Monitor, GPIB, and PILOT Software Suite (Navigator, Wafer Map, Autoalign)
  •   Four (4) programmable three-axis (X,Y, Z) manipulators with coaxial and triaxial probe arms
  •   Four (4) manual manipulators with coaxial, triaxial, and Kelvin probe arms
  •   One (1) manual manipulator with contact sense probe
  •   Assorted boxes of tungsten probe tips (12.5 um, 7 um, 1 um, and 0.1 um radius)

Device Characterization Probe SystemSemiautomatic 200 mm Device Characterization Prober System configured with  manual and programmable manipulators, a localized environmental chamber, and a thermal chuck system that operates from -60 C to 200 C

 

Device Characterization Chuck

Localized Environmental Chamber (LEC)  with triaxial thermal chuck in the load position

 

Device Characterization-1

Manual, Programmable, and Imina miBot nanopositioners integrated into a single probing platform

 

Device Characterization Probing

 

 

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Topics: Application - Device Characterization, Success Stories

Author: Denis Place

Denis Place is one of the founders of SemiProbe and has more than 35 years of experience working in the international semiconductor industry. He has degrees in electrical engineering and business management. Place is in a unique position, because he personally used and worked with probing systems for many years before starting his own semiconductor probing company.
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