Success Story – High-Power Device Characterization Application – Saudi Arabia

October 23, 2023

Customer Requirements:

A University required a small footprint and flexible probing solution that would allow them to test 100 mm wafers, chips, and packaged parts up to 3 KV. Volume was low so a manual probe system with manual manipulators and a variety of high voltage (HV) and low voltage DC probe arms were desired. The probe system would interface to a Keysight B1506. Due to the lethal voltage levels required to test the devices, a safety enclosure would be required.

Semiprobe Solution:

  • PS4L M-4 (100 mm) manual probe system
  • 100 mm thermal chuck (ambient to 200 C) with controller and High Voltage (HV) kelvin cables - 3 KV triaxial force and sense connections
  • Vibration isolation table (VIT) with shelves for instruments
  • Microscope Post with Coaxial X and Y Microscope Movement of 100 mm x 100 mm with locking knobs
  • Compound Optics with CCTV System
  • Four (4) MA-9000 manual manipulators with two (2) 3KV triaxial probe arms and two low voltage coaxial probe arms.
  • Laser Light Curtain (LLC) as a safety enclosure
  • Interconnect Panel – mounted to one side of the LLC, contains standard coaxial, triaxial, and 3 KV HV (force and sense) triaxial

A SemiProbe PS4L M-4 manual probe system configured with a thermal chuck and manual manipulators to perform device characterization at high voltages up to 3 KV

A SemiProbe PS4L M-4 manual probe system configured with a thermal chuck and manual manipulators to perform device characterization at high voltages up to 3 KV

 

Closeup view of a 3 (75 mm) power transistor wafer affixed via vacuum to a thermal chuck and being probed with manual manipulators up to 3 KV.

Closeup view of a 3 (75 mm) power transistor wafer affixed via vacuum to a thermal chuck and being probed with manual manipulators up to 3 KV

 

Typical feedthrough interconnect panel that contains low voltage coaxial and triaxial connectors, 3 KV triaxial connectors, a safety interlock and a rubberized boot for direct cable feedthrough

Typical feedthrough interconnect panel that contains low voltage coaxial and triaxial connectors, 3 KV triaxial connectors, a safety interlock and a rubberized boot for direct cable feedthrough

 

Keithley Semiconductor Device Characterization Handbook

Topics: Application - High Power, Application - Device Characterization, Manual Systems

Author: Denis Place

Denis Place is one of the founders of SemiProbe and has more than 35 years of experience working in the international semiconductor industry. He has degrees in electrical engineering and business management. Place is in a unique position, because he personally used and worked with probing systems for many years before starting his own semiconductor probing company.
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SemiProbe Capabilities & Applications Guide for Wafer Characterization & Testing