Success Story – Optoelectronics Device Characterization - Germany
Customer Requirements: Semiautomatic 300 mm Double Sided Probing (DSP) System to characterize several different types and sizes of silicon photonic devices in a ...
October 17, 2023Customer Requirements: Semiautomatic 300 mm Double Sided Probing (DSP) System to characterize several different types and sizes of silicon photonic devices in a ...
October 17, 2023The never ending quest for more capable optoelectronic devices are challenging the prober companies to develop new methods of holding, integrating products and ...
December 08, 2020Customer Requirements: The customer wanted a semiautomatic wafer probe testing system to test high power edge emitting laser diodes (EELD) in laser bar form. ...
April 20, 2020The customer wanted a semiautomatic probe system to test light emitting diodes (LEDS) in a few different modes - wafer form, wafers sawn and stretched on frames ...
May 20, 2019The customer wanted a multipurpose semiautomatic probe system to test vertical-cavity surface-emitting laser diodes (VCSELS) and edge-emitting laser diodes ...
May 20, 2019The customer wanted a 300 mm fully automatic double-sided probe system for high volume silicon photonics testing in a production environment. The system had to ...
May 13, 2019The customer wanted a manual double-sided probing (DSP) system to test silicon photonic chips and wafers using probe cards and manipulators. The top side of the ...
May 13, 2019Customer Requirements: The customer wanted a fully automatic probe system to test silicon photonic devices in wafer form that were manufactured using MEMS ...
May 13, 2019