Probing singulated and small die on wafer probing system chucks, analytical and production, is often challenging or not possible. Most chucks, ambient or thermal, ...
Customer Requirements: • A university wanted a 150 mm semiautomatic, multi-purpose, double-sided probing (DSP) system to test a variety of optoelectronic devices ...
Customer Requirements: • A Government Lab wanted a multi-purpose 200 mm semiautomatic probe system for magnet stimulation measurements. The contact to the device ...
Customer Requirements: • A Government Lab wanted a multi-purpose 200 mm semiautomatic probe system for magnet stimulation and high voltage measurements up to 3 ...
Customer Requirements: A customer in the United States was looking for a customized and small-footprint, double-sided probing system to test optoelectronic ...
Customer Requirements: •A large MEMS company required a 300 mm manual probe system that operated up to 400 C for Wafer Level Reliability (WLR) applications. The ...
Customer Requirements: • Multi-Purpose manual probing solution for die, partial wafers, wafers up to 200 mm and wafers mounted on frames. • Vibration Isolation ...
Contacting your Semiconductor Device to make electrical measurements using probe tips, multi-contact wedges and probe cards One of the main purposes of a probe ...
Success Story – Dark Environment Device Characterization – United States Customer Requirements: A customer in the United States was looking for a small-footprint ...
